Integrated Heat Spreader (IHS) from a Computer Central Processing Unit (CPU)
Electronic Component Enclosure / Heat Transfer Element · Likely Intel or AMD; identification marks have been intentionally abraded / scratched off
Pattern: Standard square-format desktop CPU IHS (Integrated Heat Spreader)
Type
Electronic Component Enclosure / Heat Transfer Element
Maker
Likely Intel or AMD; identification marks have been intentionally abraded / scratched off
Material
Nickel-plated Copper (C1100 or C1020). Despite its silver color, it is not solid silver; it is copper for thermal conductivity with a thin nickel anti-corrosion coating.
Dimensions
Approx. 37.5mm x 37.5mm; Weight approx. 20-30 grams. Consistent with LGA 115x or similar socket sizes.
Description
This is a delidded Integrated Heat Spreader (IHS). It is the metal cap that sits atop a computer processor. It is notable for having its identifying markings scratched out to hide its origin.
Key Features
Raised central plateau, perimeter glue channel, nickel-over-copper construction, square geometry.
Material & Composition
Nickel-plated Copper (C1100 or C1020). Despite its silver color, it is not solid silver; it is copper for thermal conductivity with a thin nickel anti-corrosion coating.
Finish & Decoration
Polished nickel plate with significant surface scratching and residual white thermal paste (silicone-based) around the perimeter.
Hallmarks & Stamps
None visible; the original laser engravings (brand, model, clock speed) have been deliberately scratched off the top surface.
Construction Details
Stamped or CNC-machined copper plate with a raised center area and a thin electroplated nickel finish.
Functional Features
Designed to protect the silicon die and spread heat to a cooling heat sink or water block.
Handle & Grip Details
None; edges are sharp and designed for adhesive mounting to a PCB (Printed Circuit Board).
Craftsmanship Details
Industrial high-precision machining with low tolerances for flatness, though this specific piece's surface integrity is compromised.
Authentication Indicators
Form factor matches industry-standard desktop CPU architectures; presence of silicone-based thermal interface material residue.
Origin & Manufacturing
Likely manufactured in Malaysia, China, or Vietnam in a high-tech semiconductor fabrication facility.
Era & Period
Modern Computing Era (21st Century)
Age Estimate
Circa 2010-2023 based on the form factor and common thermal paste residue.
Cultural Significance
A symbol of the digital age and the hardware-enthusiast subculture of 'overclocking' and PC building.
Condition Notes
Poor / Damaged. Significant deep scratching on the contact surface and adhesive/paste residue remains on the edges.
Value Estimate
Negligible ($0.50 - $2.00) as scrap copper or a novelty item, as it is no longer attached to a functional processor.
Care & Maintenance
Clean with 90%+ Isopropyl alcohol. If reuse is intended, the surface should be lapped (sanded flat) to remove the scratches for better thermal contact.
Similar Pieces
Vapor chambers or laptop heat-pipe assemblies; these differ in being hollow and containing fluid.
Interesting Facts
Enthusiasts often remove these (a process called "delidding") to replace the factory thermal paste with liquid metal to improve cooling efficiency.